Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory ranking 1 ECC Yes Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory ranking 1 ECC Yes Internal memory type DDR3
2 V Cooling type Heatsink Memory ranking 1 ECC Yes Memory clock speed 2666 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g
Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 7 Memory ranking 4 ECC Yes Memory clock speed 1066 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM CAS latency 7 Memory ranking 4 ECC Yes Memory clock speed 1066 MHz Internal memory type DDR3
A Hewlett Packard Enterprise equivalent 16 GB Dual rank- registered ECC DDR4 SDRAM - DIMM 288-pin 2666 MHz (PC4-21300) from Hypertec NOTE: This memory meets the memory specification requirements for reliable operation within a HP Generation 8 (or 9) server- but is not SmartMemory and does not identify as SmartMemory when installed or deliver SmartMemory specific features
2 V Memory ranking 2 ECC No Memory clock speed 2133 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 15 Memory voltage 1
Hypertec 512MB PC2100 (Legacy) memory module 0.5 GB 266 MHz ECC DDR Memory Buffered memory type RegisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to