Memory Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Internal memory type DDR3 Features Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for PC/server Internal memory type DDR3
Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3
Memory Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1333 MHz Internal memory type DDR3
Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 1 ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3
A Lenovo equivalent 4 GB Low Voltage - unbuffered Non-ECC DDR3L SDRAM - SO-DIMM 204-pin 1600 Mhz Legacy ( PC3L-12800 ) from Hypertec
Hypertec CC411A-HY (Legacy) memory module 0.5 GB DDR2 DDR3L Memory Memory layout (modules xA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to