Memory Internal memory 8 GB Memory ranking 2 Memory clock speed 1333 MHz Internal memory type DDR3 Features Internal memory 8 GB Memory ranking 2 Memory clock speed 1333 MHz Internal memory type DDR3
Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Single-channel ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Single-channel ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3
Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3
2 V Memory ranking 2 ECC No Memory clock speed 2133 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 15 Memory voltage 1
Memory Buffered memory type Registered (buffered) Internal memory 32 GB Memory ranking 4 Internal memory type DDR3 Features Buffered memory type Registered (buffered) Internal memory 32 GB Memory ranking 4 Internal memory type DDR3
Hypertec 432671-001-HY (Legacy) memory module 8 GB 1 x 8 GB DDR2 667 MHz DDR2 Memory Internal memory 8 GBA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to