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Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3
Memory Buffered memory type Registered (buffered) Internal memory 32 GB Memory ranking 4 Memory clock speed 1333 MHz Features Buffered memory type Registered (buffered) Internal memory 32 GB Memory ranking 4 Memory clock speed 1333 MHz
2 V Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 19 Memory voltage 1
Memory Buffered memory type Registered (buffered) Internal memory 32 GB Memory form factor 288-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Registered (buffered) Internal memory 32 GB Memory form factor 288-pin DIMM Memory ranking 2 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4
Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 ECC No Memory clock speed 1600 MHz Internal memory type DDR3
Hypertec X4910A-HY (Legacy) memory module 4 GB DDR3 1333 MHz ECC DDR3L Memory Buffered memory type RegisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to
