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it can determine the connection of BGA through the LED on the board
Sy 8868q/KT3BA
Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors
and assembly operations such as Flip Chip attachment to PWB substrates
heat resistance- 220 to 330
ISL6563CRZ TSRS0015 it can determine the connectionISL 6563 CRZ
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