Memory Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 4 GB Memory form factor 240-pin DIMM Memory clock speed 1600 MHz Internal memory type DDR3
2 V Memory ranking 2 ECC Yes Memory clock speed 2400 MHz Internal memory type DDR4 Weight & dimensions Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g Packaging data Package width 10 mm Package depth 150 mm Package height 55 mm Package weight 30 g
Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM Memory clock speed 2400 MHz Internal memory type DDR4 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Component for Laptop Memory form factor 260-pin SO-DIMM Memory clock speed 2400 MHz Internal memory type DDR4
Memory Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 Memory clock speed 1333 MHz Internal memory type DDR3L Features Buffered memory type Registered (buffered) Internal memory 8 GB Memory form factor 240-pin DIMM Memory ranking 2 Memory clock speed 1333 MHz Internal memory type DDR3L
2 V Memory ranking 4 ECC Yes Memory clock speed 2666 MHz Internal memory type DDR4 Features Buffered memory type Load reduced Memory layout (modules x size) 1 x 64 GB Internal memory 64 GB Component for PC Memory form factor 288-pin DIMM CAS latency 19 Memory voltage 1
Hypertec 512MB PC2700 (Legacy) memory module 0.5 GB 1 x 0.5 GB DDR 333 MHz DDR3L Memory Buffered memory type UnregisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to