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NCP81215D TSIC0783 and assembly operations such as

SKU: 35412472973

4.8
USD188.00 USD216.00

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Description

and assembly operations such as Flip Chip attachment to PWB substrates

Dimensions: 175 x 245 x 175mm

Back light 30s

it can determine the connection of BGA through the LED on the board

MAX 9789 CE

NCP81215D TSIC0783 and assembly operations such as

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