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8302 IUZ TSIC0929 Heat resistant tape used during

SKU: 32150363661

4.2
USD125.00 USD169.00

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Description

Heat resistant tape used during BGA work for protecting other components

It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis

Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors

1 x AIFEN-861DW Hot Air Rework Station

nVidia - G86-603-A2

8302 IUZ TSIC0929 Heat resistant tape used during8302 IUZ

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