Hypertec S26361-F4415-L514-HY (Legacy) memory module 4 GB DDR3 1333 MHz ECC DDR2 Energy Efficient Design

Energy Efficient Design

Memory Memory layout (modules x size) 2 x 4 GB Internal memory 8 GB Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3 Features Memory layout (modules x size) 2 x 4 GB Internal memory 8 GB Memory form factor 204-pin SO-DIMM Memory clock speed 1600 MHz Internal memory type DDR3

Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Single-channel ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory channels Single-channel ECC Yes Memory clock speed 1600 MHz Internal memory type DDR3

Lenovo memory automatically assumes the Lenovo system warranty and Lenovo provides service and support worldwide

Memory Package type DIMM Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory type PC3-10600 Memory clock speed 1333 MHz Internal memory type DDR3 Technical details Number of pins 240 Features Memory layout (modules x size) 1 x 2 GB Internal memory 2 GB Component for PC/server Memory form factor 240-pin DIMM Memory type PC3-10600 Memory clock speed 1333 MHz Internal memory type DDR3 Weight & dimensions Package type DIMM Packaging data Package type DIMM Other features Number of pins 240

Hypertec S26361-F4415-L514-HY (Legacy) memory module 4 GB DDR3 1333 MHz ECC DDR2 Energy Efficient DesignA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to