Hypertec 256 MB, DIMM 184-PIN, DDR (Legacy) memory module 0.25 GB 266 MHz DRAM Memory Buffered memory type Registered

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3 Features Buffered memory type Registered (buffered) Memory layout (modules x size) 1 x 8 GB Internal memory 8 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1866 MHz Internal memory type DDR3

2 V Design Backlight No Technical details Chips organisation 2Rx8 Memory Buffered memory type Unregistered (unbuffered) Memory layout (modules x size) 1 x 16 GB Internal memory 16 GB Component for Laptop Memory form factor 260-pin SO-DIMM CAS latency 17 Memory voltage 1

Slim form factor

Memory Buffered memory type Registered (buffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3L Features Buffered memory type Registered (buffered) Memory layout (modules x size) 2 x 8 GB Internal memory 16 GB Memory form factor 240-pin DIMM ECC Yes Memory clock speed 1333 MHz Internal memory type DDR3L

Memory Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3 Features Buffered memory type Unregistered (unbuffered) Internal memory 8 GB Component for Laptop Memory form factor 204-pin SO-DIMM ECC No Memory clock speed 1600 MHz Internal memory type DDR3

Hypertec 256 MB, DIMM 184-PIN, DDR (Legacy) memory module 0.25 GB 266 MHz DRAM Memory Buffered memory type RegisteredA Hypertec Legacy Memory Module is a module that uses no current DRAM technology and is no longer in mainstream production by OEMS and or third party suppliers. Hypertec are committed to providing a full memory upgrade landscape as part of our core product offering and as such, there may be occasions where we need to utilise professionally repurposed components. Any repurposed components are removed within a full ESD environment and then used to