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Rubert 116 Cylindrical grinding Cylindrical grinding 8 pcs, Ra (µin) 1 to 125, Ra (µm)0.025 to 3.2, N-groups 1 to 8 Spec allowing laser-cutting of thin-films used

SKU: 19421876600

4.1
USD125.00 USD167.00

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Ships within 48 hours · Estimated delivery Aug 16 - Aug 21

Description

allowing laser-cutting of thin-films used in semiconductors and liquid crystal substrates

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inspection and patternmaking work

Mark-10 Tension and Compression Force Sensors Series R03 20 lbF / 320 ozF / 10 kgF / 10000 gF / 100 N

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Rubert 116 Cylindrical grinding Cylindrical grinding 8 pcs, Ra (µin) 1 to 125, Ra (µm)0.025 to 3.2, N-groups 1 to 8 Spec allowing laser-cutting of thin-films usedRubert 116 Cylindrical grinding Cylindrical grinding 8 pcs, Ra (in) 1 to 125, Ra (m)0. 025 to 3. 2, N groups 1 to 8

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